Effect of Reflow Profile on Intermetallic Compound Formation
نویسندگان
چکیده
منابع مشابه
Effect of Reflow Profile on Intermetallic Compound Formation
Reflow soldering in a nitrogen atmosphere is a common process consideration in surface mount technology assembly. This is because the use of nitrogen in reflow equipment may benefit the process as well as the quality of the end product, where it can increase the reliability of the solder joint. So far, many papers have reported effects of cooling speed, type of solder pastes and solder fluxes o...
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ژورنال
عنوان ژورنال: IOP Conference Series: Materials Science and Engineering
سال: 2013
ISSN: 1757-899X
DOI: 10.1088/1757-899x/46/1/012037